Patent Assignment
Reel/Frame 028229/0915
Assignment of Assignor's Interest
Recorded: 2012-05-17
Pages: 2
Assignor
TAYA, TAKASHI
Executed: 2012-03-28
Assignee
LAPIS SEMICONDUCTOR CO., LTD.
550-1 HIGASHIASAKAWA-CHO HACHIOUJI-SHI, TOKYO, 193-8550, JAPAN
Covered Property
(1)
Semiconductor Chip and Test Method
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.