Patent Assignment
Reel/Frame 028230/0266
Assignment of Assignor's Interest
Recorded: 2012-05-18
Pages: 3
Assignor
SHIMIZU, KEISUKE
Executed: 2012-04-24
Assignee
IBIDEN CO., LTD.
2-1, KANDA-CHO, OGAKI-SHI, GIFU, 503-8604, JAPAN
Covered Property
(1)
Wiring Board with Built-in Electronic Component and Method for Manufacturing the Same