Patent Assignment
Reel/Frame 028268/0963
Assignment of Assignor's Interest
Recorded: 2012-05-25
Pages: 3
Assignor
KOBAYASHI, YASUKO
Executed: 2012-04-18
Assignee
ELPIDA MEMORY, INC.
2-1, YAESU 2-CHOME, CHUO-KU, TOKYO, 104-0028, JAPAN
Covered Property
(1)
Semiconductor Chip Having Bump Electrode, Semiconductor Device Having the Semiconductor Chip, and Method for Manufacturing the Semiconductor Device
Application:
13/479,806 →
Publication:
US 2012/0306074
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
Jul 29, 2013
From: PS4 LUXCO S.A.R.L.
To: ELPIDA MEMORY INC.
Reel/Frame 032414/0261 →
Assignment of Assignor's Interest
May 15, 2014
From: ELPIDA MEMORY, INC.
To: PS4 LUXCO S.A.R.L.
Reel/Frame 032901/0196 →
Change of Name
Aug 24, 2016
From: PS5 LUXCO S.A.R.L.
To: LONGITUDE SEMICONDUCTOR S.A.R.L.
Reel/Frame 039793/0880 →
Assignment of Assignor's Interest
Aug 24, 2016
From: PS4 LUXCO S.A.R.L.
To: PS5 LUXCO S.A.R.L.
Reel/Frame 039818/0506 →