Patent Assignment
Reel/Frame 028283/0186
Assignment of Assignor's Interest
Recorded: 2012-05-29
Pages: 2
Assignor
SAITO, HIROKAZU
Executed: 2012-04-22
Assignee
LAPIS SEMICONDUCTOR CO., LTD.
550-1, HIGASHIASAKAWA-CHO, HACHIOUJI-SHI, TOKYO, 193-8550, JAPAN
Covered Property
(1)
Semiconductor Device Fabrication Method and Semiconductor Device
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.