Assignment of Assignor's Interest

Recorded: 2012-05-30 Received: 2012-05-30 Pages: 2

Assignor

KODAMA, TAKUYO

Executed: 2012-05-14

Assignee

ELPIDA MEMORY, INC.

2-1, YAESU 2-CHOME, CHUO-KU, TOKYO, JPX, 104-0028, JAPAN

Covered Properties (3)

Reference Architecture For Improved Scalability Of Virtual Data Center Resources

Application: 13/483,916 →

Semiconductor Device on Which Wafer-Level Burn-in Test Is Performed and Manufacturing Method Thereof

Application: 13/483,439 →

Housing for Receiving a Bearing Component and Process for Manufacturing Same

Application: 10/808,026 →