Assignment of Assignor's Interest

Recorded: 2012-06-06 Pages: 2

Assignors

SONG, YOUNG HEE

Executed: 2012-03-27

HONG, SEONG JAE

Executed: 2012-03-12

HWANG, SEONG DEOK

Executed: 2012-03-12

Assignee

SAMSUNG LED CO., LTD.

(NONGSEO-DONG), 95 SAMSUNG2RO, GIHEUNG-GU, YONGIN-CITY,, GYEONGGI-DO, KOREA, REPUBLIC OF

Covered Property (1)

Semiconductor Light Emitting Diode Chip, Method of Manufacturing Thereof and Method for Quality Control Thereof

Application: 13/421,562 →

Publication: US 2012/0235142

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.