Patent Assignment
Reel/Frame 028333/0729
Assignment of Assignor's Interest
Recorded: 2012-06-07
Pages: 2
Assignors
LIU, PING-YIN
Executed: 2012-05-31
HUANG, XIN-HUA
Executed: 2012-05-31
CHAO, LAN-LIN
Executed: 2012-05-31
TSAI, CHIA-SHIUNG
Executed: 2012-05-31
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Three Dimensional Integrated Circuit Structures and Hybrid Bonding Methods for Semiconductor Wafers