Patent Assignment
Reel/Frame 028344/0503
Assignment of Assignor's Interest
Recorded: 2012-06-01
Pages: 3
Assignor
AKINO, MASARU
Executed: 2012-04-23
Assignee
SEIKO INSTRUMENTS INC.
8, NAKASE 1-CHOME, MIHAMA-KU, CHIBA-SHI, CHIBA, 261-8507, JAPAN
Covered Property
(1)
Semiconductor Device Having Pad Region for Wire-Bonding and Method of Manufacturing the Semiconductor Device
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.