IP Library Assignment 028367/0535
Patent Assignment
Reel/Frame 028367/0535

ASSIGNMENT OF ASSIGNOR'S INTEREST

Recorded: 2012-06-13 Received: 2012-06-13 Pages: 5
Assignors
CHOI, DAESIK
Executed: 2012-06-01
LEE, KYUNGHOON
Executed: 2012-06-01
PARK, SANGMI
Executed: 2012-06-01
PARK, YISU
Executed: 2012-06-01
YANG, JOUNGIN
Executed: 2012-06-01
Assignee
STATS CHIPPAC LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, SGX, 569059, SINGAPORE
Covered Application (1)
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH FILM ASSIST AND METHOD OF MANUFACTURE THEREOF
App. No. 13/494,721