Assignment of Assignor's Interest

Recorded: 2012-06-18 Pages: 2

Assignors

TANAKA, KEIICHI

Executed: 2012-04-05

IZUMI, SHIGETO

Executed: 2012-04-16

Assignee

NIKON CORPORATION

12-1, YURAKUCHO 1-CHOME, CHIYODA-KU, TOKYO, 100-8331, JAPAN

Covered Property (1)

Pressuring Module, Pressuring Apparatus, Substrate Bonding Apparatus, Substrate Bonding Method, and Bonded Substrate

Application: 13/431,764 →

Publication: US 2012/0251789