Patent Assignment
Reel/Frame 028421/0429
Assignment of Assignor's Interest
Recorded: 2012-06-21
Pages: 3
Assignors
TAKASU, MAYUKO
Executed: 2012-06-14
OTSU, TAKESHI
Executed: 2012-06-18
TAKIZAWA, KENICHI
Executed: 2012-06-14
MORI, YUTAKA
Executed: 2012-06-15
Assignee
MITSUBISHI CHEMICAL CORPORATION
1-1, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-8251, JAPAN
Covered Property
(1)
Material for a Molded Resin for Use in a Semiconductor Light-Emitting Device
Application:
13/529,587 →
Publication:
US 2012/0286220