Patent Assignment
Reel/Frame 028437/0751
Assignment of Assignor's Interest
Recorded: 2012-06-25
Pages: 4
Assignors
USUI, HIROYUKI
Executed: 2012-05-08
SHINYA, YOSHIHISA
Executed: 2012-05-16
ENDO, YASUMI
Executed: 2012-05-16
Assignee
SONY CHEMICAL & INFORMATION DEVICE CORPORATION
GATE CITY OSAKI, EAST TOWER 8TH FLOOR, 1-11-2, OSAKI, SHINAGAWA-KU, TOKYO, 141-0032, JAPAN
Covered Property
(1)
Bonding Device and Method for Producing Plate-Shaped Bonded Assembly
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.