Patent Assignment
Reel/Frame 028438/0426
Assignment of Assignor's Interest
Recorded: 2012-06-25
Pages: 5
Assignors
KIM, KWANG SOO
Executed: 2012-05-18
LEE, YOUNG KI
Executed: 2012-05-18
PARK, JI HYUN
Executed: 2012-05-18
SUH, BUM SEOK
Executed: 2012-05-18
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314, MAETAN 3-DONG, YEONGTONG-GU, SUWON,, GYUNGGI-DO, 443-743, KOREA, REPUBLIC OF
Covered Property
(1)
Double Side Cooling Power Semiconductor Module and Multi-Stacked Power Semiconductor Module Package Using the Same