Patent Assignment
Reel/Frame 028464/0197
Assignment of Assignor's Interest
Recorded: 2012-06-28
Pages: 8
Assignors
ZHANG, WANG
Executed: 2012-06-06
SU, XILIN
Executed: 2012-06-08
XIE, CHUNLIN
Executed: 2012-06-06
HU, HONGBO
Executed: 2012-06-09
Assignees
SHENZHEN BYD AUTO R&D COMPANY LIMITED
PART B, 1/F, BLDG #B2, YUCAN INDUSTRIAL AREA, LANZHU ROAD, SHENZHEN EXPORT PROCESSING ZONE, SHENZHEN GRAND INDUSTRIAL ZONE, SHENZHEN, GUANGDONG, P.R., 518118, CHINA
BYD COMPANY LIMITED
NO. 3009, BYD ROAD, PINGSHAN, SHENZHEN, GUANGDONG, P.R., 518118, CHINA
Covered Property
(1)
Epitaxiay Wafer, Method for Manufacturing the Same and Method for Manufacturing Led Chip
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.