Patent Assignment
Reel/Frame 028502/0179
Assignment of Assignor's Interest
Recorded: 2012-07-06
Pages: 4
Assignors
LIU, PING-YIN
Executed: 2012-06-28
LIN, SHIH-WEI
Executed: 2012-06-28
HUANG, XIN-HUA
Executed: 2012-06-28
CHAO, LAN-LIN
Executed: 2012-06-28
TSAI, CHIA-SHIUNG
Executed: 2012-06-28
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Hybrid Bonding Systems and Methods for Semiconductor Wafers