IP Library Assignment 028571/0397
Patent Assignment
Reel/Frame 028571/0397

Assignment of Assignor's Interest

Recorded: 2012-07-05 Pages: 2
Assignors
ROH, HYUNG SANG
Executed: 2012-06-27
KOO, JA-YONG
Executed: 2012-06-27
KIM, SUNG CHEAL
Executed: 2012-06-27
PARK, WON-KYU
Executed: 2012-06-27
LEE, CHANG-HA
Executed: 2012-06-27
Assignee
SAMSUNG CORNING PRECISION MATERIALS CO.,LTD.
644-1 JINPYEONG-DONG, GUMI-SI, GYEONGSANGBUK-DO 730-360, KOREA, REPUBLIC OF
Covered Property (1)
Breaking Apparatus for Glass Substrate
Patent: 8,944,304 →
Application: 13/541,177 →
Publication: US 2013/0292444
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Jun 20, 2014
From: SAMSUNG CORNING PRECISION MATERIALS CO., LTD.
To: CORNING PRECISION MATERIALS CO., LTD.
Reel/Frame 033205/0584 →
Assignment of Assignor's Interest May 6, 2015
From: ROH, HYUNG-SANG; KOO, JA-YONG; KIM, SUNG CHEAL; PARK, WON-KYU
To: SAMSUNG CORNING PRECISION MATERIALS CO., LTD.
Reel/Frame 035575/0929 →