Assignment of Assignor's Interest

Recorded: 2012-07-23 Pages: 2

Assignor

SHINDOU, MASANORI

Executed: 2012-07-03

Assignee

LAPIS SEMICONDUCTOR CO., LTD.

550-1 HIGASHIASAKAWA-CHO HACHIOUJI-SHI, TOKYO, 193-8550, JAPAN

Covered Property (1)

Semiconductor Device Manufacturing Method and Semiconductor Device Manufacturing Apparatus

Patent: 8,883,635 →

Application: 13/555,969 →

Publication: US 2013/0023117

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.