Patent Assignment
Reel/Frame 028658/0375
Assignment of Assignor's Interest
Recorded: 2012-07-27
Pages: 2
Assignors
NAKAMURA, NOBUYUKI
Executed: 2012-07-19
MURAMOTO, TAKUYUKI
Executed: 2012-07-19
TSUKAMOTO, TAKEO
Executed: 2012-07-19
Assignee
ELPIDA MEMORY, INC.
2-1, YAESU 2-CHOME, CHUO-KU, TOKYO, 104-0028, JAPAN
Covered Property
(1)
Semiconductor Device Having Through-Substrate via with Insulating Portion
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
Jul 29, 2013
From: PS4 LUXCO S.A.R.L.
To: ELPIDA MEMORY INC.
Reel/Frame 032414/0261 →
Assignment of Assignor's Interest
May 15, 2014
From: ELPIDA MEMORY, INC.
To: PS4 LUXCO S.A.R.L.
Reel/Frame 032898/0319 →
Change of Name
Aug 24, 2016
From: PS5 LUXCO S.A.R.L.
To: LONGITUDE SEMICONDUCTOR S.A.R.L.
Reel/Frame 039793/0880 →
Assignment of Assignor's Interest
Aug 24, 2016
From: PS4 LUXCO S.A.R.L.
To: PS5 LUXCO S.A.R.L.
Reel/Frame 039818/0506 →
Assignment of Assignor's Interest
Aug 21, 2018
From: LONGITUDE SEMICONDUCTOR S.A.R.L.
To: LONGITUDE LICENSING LIMITED
Reel/Frame 046863/0001 →