IP Library › Assignment 028702/0913
Patent Assignment
Reel/Frame 028702/0913

Assignment of Assignor's Interest

Recorded: 2012-08-01 Pages: 9
Assignors
JIANG, ZHIWEI
Executed: 2012-07-28
CHEN, XIAOCHEN
Executed: 2012-07-31
GUO, ZHIPENG
Executed: 2012-07-30
Assignee
HUAWEI DEVICE CO., LTD.
BUILDING B2 HUAWEI INDUSTRIAL BASE, BANTIAN, LONGGANG DISTRICT, SHENZHEN, GUANGDONG, 518129, CHINA
Covered Property (1)
Printed Circuit Board Assembly Chip Package Component and Soldering Component
Patent: 8,908,386 →
Application: 13/564,483 →
Publication: US 2012/0295454
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Jun 12, 2018
From: HUAWEI DEVICE CO.,LTD.
To: HUAWEI DEVICE (SHENZHEN) CO., LTD.
Reel/Frame 046340/0590 →
Assignment of Assignor's Interest Nov 19, 2018
From: HUAWEI DEVICE (SHENZHEN) CO., LTD.
To: HUAWEI DEVICE CO., LTD.
Reel/Frame 047603/0039 →