Assignment of Assignor's Interest

Recorded: 2012-08-02 Pages: 3

Assignor

JAN, SHIN-DAR

Executed: 2012-07-18

Assignee

LARVIEW TECHNOLOGIES CORPORATION

NO. 159, SEC. 1, ZHONGSHAN N. RD.,, YANGMEI CITY, TAOYUAN COUNTY, 326, TAIWAN

Covered Property (1)

Pierced Substrate on Chip Module Structure

Application: 13/565,600 →

Publication: US 2014/0035165

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.