Patent Assignment
Reel/Frame 028721/0921
Assignment of Assignor's Interest
Recorded: 2012-08-03
Pages: 3
Assignor
SON, HO YOUNG
Executed: 2012-07-16
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Chip and Stacked Semiconductor Package Having the Same
Application:
13/566,118 →
Publication:
US 2013/0161826