Patent Assignment
Reel/Frame 028724/0626
Assignment of Assignor's Interest
Recorded: 2012-08-02
Pages: 3
Assignors
KIM, WON-KEUN
Executed: 2012-07-06
SONG, HYUN-JUNG
Executed: 2012-07-05
CHOI, EUN-YOUNG
Executed: 2012-07-05
JANG, HYE-YOUNG
Executed: 2012-07-19
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method of Manufacturing the Same