Patent Assignment
Reel/Frame 028810/0663
Assignment of Assignor's Interest
Recorded: 2012-08-20
Pages: 3
Assignor
HAN, KWON WHAN
Executed: 2012-08-01
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Package of Electronic Device Including Connecting Bump, System Including the Same and Method for Fabricating the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.