Patent Assignment
Reel/Frame 028845/0807
Assignment of Assignor's Interest
Recorded: 2012-08-24
Pages: 4
Assignors
TSENG, CHI-XIANG
Executed: 2012-08-21
LEE, HSIAO-WEN
Executed: 2012-08-21
WU, MIN-SHENG
Executed: 2012-08-21
LIN, TIEN-MING
Executed: 2012-08-12
Assignee
TSMC SOLID STATE LIGHTING LTD.
9, LI-HSIN 4TH ROAD, HSINCHU SCIENCE PARK, HSINCHU, 300-77, TAIWAN
Covered Property
(1)
Method and Apparatus for Fabricating Phosphor-Coated Led Dies
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Nov 25, 2015
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 037160/0198 →
Merger
Nov 25, 2015
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 037160/0212 →
Change of Name
Apr 22, 2026
From: EPISTAR CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075513/0783 →