Patent Assignment
Reel/Frame 028891/0698
Assignment of Assignor's Interest
Recorded: 2012-09-04
Pages: 3
Assignor
SCHWANDNER, JUERGEN
Executed: 2012-07-31
Assignee
SILTRONIC AG
HANNS-SEIDEL-PLATZ 4, MUNICH, 81737, GERMANY
Covered Property
(1)
Method for the Double-Side Polishing of a Semiconductor Wafer
Application:
13/602,455 →
Publication:
US 2013/0072091