Patent Assignment
Reel/Frame 028900/0130
Assignment of Assignor's Interest
Recorded: 2012-09-05
Pages: 2
Assignee
SHINKO ELECTRIC INDUSTRIES CO., LTD.
80, OSHIMADA-MACHI, NAGANO-SHI, NAGANO, 381-2287, JAPAN
Covered Property
(1)
Wiring Substrate, Method of Manufacturing the Same, and Semiconductor Device