Patent Assignment
Reel/Frame 028912/0704
Assignment of Assignor's Interest
Recorded: 2012-09-07
Pages: 5
Assignors
SEGAWA, HIROSHI
Executed: 2012-07-31
NAGANUMA, NOBUYUKI
Executed: 2012-08-22
TAKAHASHI, MICHIMASA
Executed: 2012-07-03
ISHIHARA, TERUYUKI
Executed: 2012-07-03
Assignee
IBIDEN CO., LTD.
2-1, KANDA-CHO, OGAKI-SHI, GIFU, 503-8604, JAPAN
Covered Property
(1)
Wiring Board and Method for Manufacturing the Same