Patent Assignment
Reel/Frame 028953/0355
Assignment of Assignor's Interest
Recorded: 2012-09-13
Pages: 4
Assignors
CHEN, MENG-TSE
Executed: 2012-06-25
LIU, YU-CHIH
Executed: 2012-06-25
HUANG, HUI-MIN
Executed: 2012-06-25
LIN, WEI-HUNG
Executed: 2012-06-25
LU, JING RUEI
Executed: 2012-06-25
CHENG, MING-DA
Executed: 2012-06-25
LIU, CHUNG-SHI
Executed: 2012-06-25
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Package-On-Package Structure Having Polymer-Based Material for Warpage Control