Patent Assignment
Reel/Frame 028956/0047
Assignment of Assignor's Interest
Recorded: 2012-09-13
Pages: 3
Assignor
LEE, JIN HUI
Executed: 2012-09-10
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Chip and Stacked Semiconductor Package Having the Same