Patent Assignment
Reel/Frame 028975/0627
Assignment of Assignor's Interest
Recorded: 2012-09-14
Pages: 5
Assignors
OH, CHANG-WOO
Executed: 2012-08-02
KANG, MYUNG-GIL
Executed: 2012-08-02
JUNG, YOUNG-CHAI
Executed: 2012-08-02
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Integrated Circuit Devices Including Stress Proximity Effects and Methods of Fabricating the Same