IP Library Assignment 029230/0155
Patent Assignment
Reel/Frame 029230/0155

Assignment of Assignor's Interest

Recorded: 2012-11-02 Pages: 2
Assignor
ITOH, KAZUO
Executed: 2010-12-02
Assignee
PANASONIC CORPORATION
1006 OAZA KADOMA, KADOMA-SHI, OSAKA, 571-8501, JAPAN
Covered Property (1)
Semiconductor Device Comprising Multilayer Interconnect Structure with Overlapping Vias
Patent: 8,405,224 →
Application: 12/982,064 →
Publication: US 2011/0089574
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 27, 2020
From: PANASONIC CORPORATION
To: PANASONIC SEMICONDUCTOR SOLUTIONS CO., LTD.
Reel/Frame 052755/0917 →