IP Library › Assignment 029257/0546
Patent Assignment
Reel/Frame 029257/0546

Assignment of Assignor's Interest

Recorded: 2012-11-07 Pages: 3
Assignors
HASEGAWA, YU
Executed: 2012-10-12
KATAGIRI, MITSUAKI
Executed: 2012-10-12
Assignee
ELPIDA MEMORY, INC.
2-1, YAESU 2-CHOME, CHUO-KU, TOKYO, JAPAN
Covered Property (1)
Device Having Electrodes Formed from Bumps with Different Diameters
Patent: 9,048,221 →
Application: 13/671,033 →
Publication: US 2013/0127048
Related Assignments (5)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement Jul 29, 2013
From: PS4 LUXCO S.A.R.L.
To: ELPIDA MEMORY INC.
Reel/Frame 032414/0261 →
Assignment of Assignor's Interest May 15, 2014
From: ELPIDA MEMORY, INC.
To: PS4 LUXCO S.A.R.L.
Reel/Frame 032901/0196 →
Change of Name Aug 24, 2016
From: PS5 LUXCO S.A.R.L.
To: LONGITUDE SEMICONDUCTOR S.A.R.L.
Reel/Frame 039793/0880 →
Assignment of Assignor's Interest Aug 24, 2016
From: PS4 LUXCO S.A.R.L.
To: PS5 LUXCO S.A.R.L.
Reel/Frame 039818/0506 →
Assignment of Assignor's Interest Aug 21, 2018
From: LONGITUDE SEMICONDUCTOR S.A.R.L.
To: LONGITUDE LICENSING LIMITED
Reel/Frame 046863/0001 →