Patent Assignment
Reel/Frame 029274/0302
Assignment of Assignor's Interest
Recorded: 2012-11-09
Pages: 2
Assignor
CHEN, HSIEN-WEI
Executed: 2012-11-06
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Stress Relief Structures in Package Assemblies