Patent Assignment
Reel/Frame 029300/0514
Release of Security Interest in Patents
Recorded: 2012-11-14
Pages: 7
Assignor
WELLS FARGO BANK, NATIONAL ASSOCIATION
Executed: 2012-11-08
Assignee
HANDY & HARMAN ELECTRONIC MATERIALS CORPORATION
1133 WESTCHESTER AVENUE, SUITE N222, WHITE PLAINS, NEW YORK, 10604
Covered Properties
(3)
Low Friction Solder Electrodeposits
Patent:
5,667,659 →
Application:
08/627,542 →
Low Friction, Ductile, Multilayer Electrodeposits
Patent:
5,853,557 →
Application:
08/833,009 →
Barrier Layer for Electrical Connectors and Methods of Applying the Layer
Related Assignments
(2)
Other recorded transfers of the patents in this record — the chain of ownership.
Security Agreement
Jan 7, 2010
From: STEEL PARTNERS II, L.P.
To: STEEL PARTNERS II LIQUIDATING SERIES TRUST - SERIES E
Reel/Frame 023741/0717 →
Security Agreement
Nov 16, 2012
From: ARLON LLC; CONTINENTAL INDUSTRIES, INC.; HANDY & HARMAN; LUCAS-MILHAUPT, INC.
To: PNC BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 029308/0304 →