Patent Assignment
Reel/Frame 029316/0810
Assignment of Assignor's Interest
Recorded: 2012-11-17
Pages: 5
Assignors
CHA, MING-HONG
Executed: 2012-10-26
CHUANG, CHITA
Executed: 2012-10-16
CHUANG, YAO-CHUN
Executed: 2012-10-16
LIU, HAO-JUIN
Executed: 2012-10-16
CHIANG, TSUNG-HSIEN
Executed: 2012-10-16
KUO, CHEN-CHENG
Executed: 2012-10-24
CHEN, CHEN-SHIEN
Executed: 2012-10-17
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN ROAD 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Bonded Structures for Package and Substrate