Patent Assignment
Reel/Frame 029329/0846
Assignment of Assignor's Interest
Recorded: 2012-11-20
Pages: 4
Assignee
SHINKO ELECTRIC INDUSTRIES CO., LTD.
80, OSHIMADA-MACHI, NAGANO-SHI,, NAGANO, 381-2287, JAPAN
Covered Property
(1)
Wiring Substrate Including Projecting Part Having Electrode Pad Formed Thereon