Patent Assignment
Reel/Frame 029337/0782
Assignment of Assignor's Interest
Recorded: 2012-11-21
Pages: 2
Assignors
LU, CHUN-LIN
Executed: 2012-11-15
LIU, MING-KAI
Executed: 2012-11-15
WU, KAI-CHIANG
Executed: 2012-11-15
YANG, CHING-FENG
Executed: 2012-11-15
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Method for Forming Package-on-Package Structure