Patent Assignment
Reel/Frame 029361/0961
Assignment of Assignor's Interest
Recorded: 2012-11-28
Pages: 3
Assignee
STMICROELECTRONICS PTE LTD.
28 ANG MO KIO INDUSTRIAL PARK II, AVENUE 3, SINGAPORE, 569508, SINGAPORE
Covered Property
(1)
Wafer Level Packaging, Optical Detection Sensor and Method of Forming Same
Application:
13/670,766 →
Publication:
US 2013/0119282