IP Library Assignment 029407/0188
Patent Assignment
Reel/Frame 029407/0188

Assignment of Assignor's Interest

Recorded: 2012-12-05 Pages: 2
Assignors
TAYLOR, RALPH S.
Executed: 2012-12-03
STALLER, STEVEN E.
Executed: 2012-12-03
Assignee
DELPHI TECHNOLOGIES, INC.
P. O. BOX 5052, M/C: 483-400-402, TROY, MICHIGAN, 48007-5052
Covered Property (1)
Atomic Level Bonding for Electronics Packaging
Patent: 8,754,512 →
Application: 13/705,269 →
Publication: US 2014/0151864
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 22, 2018
From: DELPHI TECHNOLOGIES, INC.
To: DELPHI TECHNOLOGIES IP LIMITED
Reel/Frame 045109/0947 →
Change of Name Sep 18, 2024
From: DELPHI TECHNOLOGIES IP LIMITED
To: BORGWARNER US TECHNOLOGIES LLC
Reel/Frame 068985/0968 →