IP Library Assignment 029428/0190
Patent Assignment
Reel/Frame 029428/0190

Assignment of Assignor's Interest

Recorded: 2012-12-07 Pages: 4
Assignors
KOKUBO, TADASHI
Executed: 2012-12-05
OUCHI, KATSUYA
Executed: 2012-12-05
IWAHARA, TAKAHISA
Executed: 2012-12-05
HIRABAYASHI, KAZUHIKO
Executed: 2012-12-05
OKOSHI, HIROSHI
Executed: 2012-12-05
TOZAWA, TOMOKAZU
Executed: 2012-12-05
OZAKI, SHUHEI
Executed: 2012-12-05
Assignee
KANEKA CORPORATION
2-4, NAKANOSHIMA 3-CHOME, KITA-KU, OSAKA-SHI, OSAKA, 530-8288, JAPAN
Covered Property (1)
Curable Resin Composition, Curable Resin Composition Tablet, Molded Body, Semiconductor Package, Semiconductor Component and Light Emitting Diode
Patent: 9,178,120 →
Application: 13/638,992 →
Publication: US 2013/0082369
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Address Sep 12, 2013
From: KANEKA CORPORATION
To: KANEKA CORPORATION
Reel/Frame 031207/0283 →