Patent Assignment
Reel/Frame 029441/0129
Assignment of Assignor's Interest
Recorded: 2012-12-11
Pages: 6
Assignors
MEYER, THORSTEN
Executed: 2012-12-04
BRUNNBAUER, MARKUS
Executed: 2012-12-04
WAIDHAS, BERND
Executed: 2012-12-04
Assignee
INTEL MOBILE COMMUNICATION GMBH
AM CAMPEON 10-12, NEUBIBERG, 85579, GERMANY
Covered Property
(1)
Chip Package and a Method for Manufacturing a Chip Package
Application:
13/693,109 →
Publication:
US 2014/0151700
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Name of the Assignee on the Cover Sheet Which Should Read: Intel Mobile Communications Gmbh Previously Recorded on Reel 029441 Frame 0129. Assignor(S) Hereby Confirms the Assignment on Page 2 and 3.
Dec 18, 2012
From: MEYER, THORSTEN; BRUNNBAUER, MARKUS; WAIDHAS, BERND
To: INTEL MOBILE COMMUNICATIONS GMBH
Reel/Frame 029486/0280 →
Assignment of Assignor's Interest
Aug 29, 2022
From: INTEL DEUTSCHLAND GMBH
To: INTEL CORPORATION
Reel/Frame 061356/0001 →