Patent Assignment
Reel/Frame 029464/0496
Assignment of Assignor's Interest
Recorded: 2012-12-13
Pages: 3
Assignors
LEE, SUN CHEOL
Executed: 2012-11-30
KIM, WOO SUP
Executed: 2012-11-30
KIM, DONG GUN
Executed: 2012-11-30
KIM, KYEONG JUN
Executed: 2012-11-30
LEE, KYU HO
Executed: 2012-11-30
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314 MAETAN 3-DONG, YEONGTONG-GU, SUWON, GYUNGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Laminated Chip Electronic Component, Board for Mounting the Same, and Packing Unit Thereof