Patent Assignment
Reel/Frame 029472/0782
Assignment of Assignor's Interest
Recorded: 2012-12-14
Pages: 8
Assignors
KANG, JONG-HOON
Executed: 2012-11-07
KIM, TAEGON
Executed: 2012-11-07
CHOI, HANMEI
Executed: 2012-11-07
JO, EUNYOUNG
Executed: 2012-11-07
KANG, GONSU
Executed: 2012-11-07
KANG, SUNGHO
Executed: 2012-11-07
HEO, SUNGHO
Executed: 2012-11-07
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Methods of Thermally Treating a Semiconductor Wafer