Patent Assignment
Reel/Frame 029477/0076
Assignment of Assignor's Interest
Recorded: 2012-12-10
Pages: 7
Assignors
JAN MARINISSEN, ERIK
Executed: 2012-11-02
VERBREE, JACOBUS
Executed: 2012-11-06
KONIJNENBURG, MARIO
Executed: 2012-10-31
CHI, CHUN-CHUAN
Executed: 2012-10-31
Assignees
IMEC
KAPELDREEF 75, LEUVEN, 3001, BELGIUM
STICHTING IMEC NEDERLAND
HIGH TECH CAMPUS 31, EINDHOVEN, 5656AE, NETHERLANDS
Covered Property
(1)
Test Access Architecture for Tsv-Based 3D Stacked Ics