Patent Assignment
Reel/Frame 029537/0463
Assignment of Assignor's Interest
Recorded: 2012-12-21
Pages: 2
Assignor
CHOI, HYEONG SEOK
Executed: 2012-11-28
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Conductive Bump, Semiconductor Chip and Stacked Semiconductor Package Using the Same