Patent Assignment
Reel/Frame 029567/0496
Assignment of Assignor's Interest
Recorded: 2013-01-04
Pages: 4
Assignors
SENDA, TAKESHI
Executed: 2012-10-04
ARAKI, KOJI
Executed: 2012-10-04
AOKI, TATSUHIKO
Executed: 2012-10-04
SUDO, HARUO
Executed: 2012-10-04
MAEDA, SUSUMU
Executed: 2012-10-04
Assignee
COVALENT SILICON CORPORATION
6-861-5, SEIRO-MACHI HIGASHIKO, KITAKANBARA-GUN, NIIGATA, JAPAN
Covered Property
(1)
Method for Heat-Treating Silicon Wafer
Application:
13/626,151 →
Publication:
US 2013/0078588
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.