Patent Assignment
Reel/Frame 029580/0768
Assignment of Assignor's Interest
Recorded: 2013-01-07
Pages: 4
Assignors
CHEN, HSU-HSIEN
Executed: 2012-12-17
CHEN, CHIH-HUA
Executed: 2012-12-17
YEH, EN-HSIANG
Executed: 2012-12-19
LIU, MONSEN
Executed: 2012-12-19
CHEN, CHEN-SHIEN
Executed: 2012-12-17
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Methods and Apparatus for Forming Package-On-Packages