Patent Assignment
Reel/Frame 029582/0156
Assignment of Assignor's Interest
Recorded: 2012-12-17
Pages: 4
Assignee
SAMSUNG CORNING PRECISION MATERIALS CO., LTD.
644-1, JINPYEONG-DONG, GUMI-SI, GYEONGSANGBUK-DO, 730-735, KOREA, REPUBLIC OF
Covered Property
(1)
Method Of Machining Semiconductor Substrate
Application:
13/712,017 →
Publication:
US 2013/0149941
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.