Patent Assignment
Reel/Frame 029595/0339
Assignment of Assignor's Interest
Recorded: 2013-01-09
Pages: 3
Assignor
WAGNER, RALPH
Executed: 2012-08-02
Assignee
OSRAM OPTO SEMICONDUCTORS GMBH
LEIBNIZSTRASSE 4, REGENSBURG, 93055, GERMANY
Covered Property
(1)
Method for Slicing a Substrate Wafer
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.