Patent Assignment
Reel/Frame 029597/0452
NUNC PRO TUNC ASSIGNMENT EFFECTIVE 11/01/2012
Recorded: 2013-01-09
Received: 2013-01-09
Pages: 9
Assignor
UNITIVE INTERNATIONAL, LTD.
Executed: 2012-12-19
Assignee
AMKOR TECHNOLOGY, INC.
1900 SOUTH PRICE ROAD, CHANDLER, AZ, 85286, UNITED STATES
Covered Applications
(52)
METHODS AND SYSTEMS FOR SUPPORTING A WORKPIECE AND FOR HEAT-TREATING THE WORKPIECE
App. No. 13/359,857
→
IRRADIANCE PULSE HEAT-TREATING METHODS AND APPARATUS
App. No. 13/182,341
→
WORKPIECE BREAKAGE PREVENTION METHOD AND APPARATUS
App. No. 12/993,077
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ELECTRONIC STRUCTURES INCLUDING CONDUCTIVE LAYERS COMPRISING COPPER AND HAVING A THICKNESS OF AT LEAST 0.5 MICROMETERS
App. No. 12/963,005
→
ELECTRONIC STRUCTURES INCLUDING BARRIER LAYERS AND/OR OXIDATION BARRIERS DEFINING LIPS AND RELATED METHODS
App. No. 12/907,430
→
HIGH-INTENSITY ELECTROMAGNETIC RADIATION APPARATUS AND METHODS
App. No. 12/835,589
→
SOLDER STRUCTURES INCLUDING BARRIER LAYERS WITH NICKEL AND/OR COPPER
App. No. 12/437,632
→
ELECTRONIC STRUCTURES INCLUDING BARRIER LAYERS DEFINING LIPS
App. No. 12/194,999
→
IRRADIANCE PULSE HEAT-TREATING METHODS AND APPARATUS
App. No. 12/053,102
→
SYSTEMS AND METHODS FOR SUPPORTING A WORKPIECE DURING HEAT-TREATING
App. No. 11/940,983
→
METHODS OF FORMING ELECTRONIC STRUCTURES INCLUDING CONDUCTIVE SHUNT LAYERS AND RELATED STRUCTURES
App. No. 11/868,785
→
CONDUCTIVE STRUCTURES INCLUDING TITANIUM-TUNGSTEN BASE LAYERS
App. No. 11/765,648
→
Repeatable heat-treating methods and apparatus
App. No. 11/521,074
→
ELECTRONIC DEVICES INCLUDING OFFSET CONDUCTIVE BUMPS
App. No. 11/446,341
→
SOLDER STRUCTURES FOR OUT OF PLANE CONNECTIONS
App. No. 11/362,964
→
TEMPERATURE MEASUREMENT AND HEAT-TREATING METHODS AND SYSTEMS
App. No. 11/302,600
→
NON-CIRCULAR VIA HOLES FOR BUMPING PADS AND RELATED STRUCTURES
App. No. 11/270,366
→
METHODS OF FORMING ELECTRONIC STRUCTURES INCLUDING CONDUCTIVE SHUNT LAYERS AND RELATED STRUCTURES
App. No. 11/226,569
→
OPTICAL STRUCTURES INCLUDING LIQUID BUMPS AND RELATED METHODS
App. No. 11/213,414
→
METHODS OF FORMING LEAD FREE SOLDER BUMPS
App. No. 11/170,220
→
METHODS OF FORMING BUMPS USING BARRIER LAYERS AS ETCH MASKS
App. No. 11/075,474
→
APPARATUSES AND METHODS FOR SUPPRESSING THERMALLY-INDUCED MOTION OF A WORKPIECE
App. No. 11/018,388
→
Mitigation strategies for electromigration in solder bumps
App. No. 60/626,802
→
TEMPERATURE MEASUREMENT AND HEAT-TREATING METHODS AND SYSTEM
App. No. 10/497,447
→
METHODS OF PROVIDING SOLDER STRUCTURES FOR OUT PLANE CONNECTIONS
App. No. 10/965,640
→
Methods of forming binary lead free solder bumps and related structures
App. No. 60/584,016
→
METHODS OF FORMING CONDUCTIVE STRUCTURES INCLUDING TITANIUM-TUNGSTEN BASE LAYERS AND RELATED STRUCTURES
App. No. 10/879,411
→
ELECTRONIC DEVICES INCLUDING METALLURGY STRUCTURES FOR WIRE AND SOLDER BONDING
App. No. 10/837,830
→
Methods of forming bumps using barrier layers as etch masks and related structures
App. No. 60/552,051
→
LOW TEMPERATURE METHODS OF BONDING COMPONENTS AND RELATED STRUCTURES
App. No. 10/790,967
→
METHODS OF SELECTIVELY BUMPING INTEGRATED CIRCUIT SUBSTRATES AND RELATED STRUCTURES
App. No. 10/780,529
→
APPARATUS AND METHODS FOR PRODUCING ELECTROMAGNETIC RADIATION
App. No. 10/777,995
→
Methods and systems for supporting a workpiece and for heat-treating the workpiece
App. No. 10/742,575
→
STACKED ELECTRONIC STRUCTURES INCLUDING OFFSET SUBSTRATES
App. No. 10/689,976
→
Solder structures for out of plane connections
App. No. 60/510,819
→
Metal wiring with base layer and related methods
App. No. 60/507,587
→
Redistribution layer for flip clip applications
App. No. 60/490,340
→
ELECTRONIC STRUCTURES INCLUDING CONDUCTIVE SHUNT LAYERS
App. No. 10/601,938
→
HEAT-TREATING METHODS AND SYSTEMS
App. No. 10/427,094
→
Selective bumping - a process for bumping wafers with exposed metal layers
App. No. 60/448,096
→
Multilevel IC interconnection structure
App. No. 60/420,422
→
Strategies for reducing current crowding at the via edge
App. No. 60/391,511
→
ELECTROPLATING METHODS INCLUDING MAINTAINING A DETERMINED ELECTROPLATING VOLTAGE AND RELATED SYSTEMS
App. No. 10/044,387
→
LOW TEMPERATURE METHODS OF BONDING COMPONENTS AND RELATED STRUCTURES
App. No. 10/017,350
→
HEAT-TREATING METHODS AND SYSTEMS
App. No. 10/005,186
→
METHODS OF POSITIONING COMPONENTS USING LIQUID PRIME MOVERS AND RELATED STRUCTURES
App. No. 10/008,466
→
METHODS AND SYSTEMS FOR POSITIONING SUBSTRATES USING SPRING FORCE OF PHASE-CHANGEABLE BUMPS THEREBETWEEN
App. No. 10/016,270
→
METHODS OF FORMING METALLURGY STRUCTURES FOR WIRE AND SOLDER BONDING
App. No. 09/966,316
→
Liquid surface geometry adjustment by variation of surface tension
App. No. 60/314,240
→
SPATIALLY RESOLVED TEMPERATURE MEASUREMENT AND IRRADIANCE CONTROL
App. No. 09/879,519
→
CONTROLLED-SHAPED SOLDER RESERVOIRS FOR INCREASING THE VOLUME OF SOLDER BUMPS
App. No. 09/790,421
→
Electroplating using voltage control and/or integrated charge
App. No. 60/261,704
→